Accelerating the Next Era of AI: Celestica and AMD Collaborate on the AMD Helios Rack-Scale AI Solution
The Celestica DS6010 is a high-performance 1OU cabled-backplane scale-up switch specifically engineered and fully qualified for integration with the AMD Helios rack-scale solution, built to handle the massive data demands of modern AI and GPU clusters.
WHY CHOOSE DS6010?
- Elite Switching Power: Dual Broadcom Tomahawk 6 ASICs deliver 204.8 Tbps non-blocking capacity for extreme AI throughput
- High-Density Connectivity: Supports 224G PAM4 SerDes via cabled backplane to interconnect up to 72 GPUs
- Advanced Control Plane: Features an 8-core AMD Ryzen™ V3000 CPU with 64GB DDR5 for rapid local processing
- Advanced Liquid Cooling to manage a 7300W high-density thermal load
BENEFITS
Open AMD Helios Rack-Scale Solution Integration: Fully qualified for AMD Helios, ensuring “plug-and-play” compatibility in OCP (Open Compute Platform) ORW (Open-Rack Wide) racks
Massive GPU Scalability: High SerDes density enables efficient GPU cluster scaling while minimizing AI training latency
Mission-Critical Uptime: Engineered for reliability with automatic BIOS/BMC fail-over recovery
Streamlined Management: Dedicated RunBMC supports remote diagnostics, SOL, and online upgrades via 1G/10G OOB ports
DS6010 FEATURES
- 224G SERDES to cabled-backplane connectors
- 2 ports 100GbE (QSFP28) OOB management
- 1x RJ45 GbE management
- 1x RJ45 10GbE LAN management
- 1x USB 3.0 Type A
- 2x RJ45 and 1x USB-C console ports
- 45V - 59V DC bus bar
- Advanced liquid cooling
- OCP (Open Compute Platform) ORW (Open-Rack Wide) racks
- Part of a portfolio of industry leading switches
OPTIMIZED FOR AI CLUSTERS
Al/ML and Emerging Technologies
Big Data and Analytics
AI training, distributed inference, sovereign AI deployments
RESOURCES
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